a thesis in the record
Through-wafer 3-D micromachining and its applications for neural interfaces and microrelays
1999 · California Institute of Technology · doctoral · Electrical Engineering
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@misc{academicancestry_caltechthesis_caltechthesis_4474,
author = {{Academic Ancestry}},
title = {{Through-wafer 3-D micromachining and its applications for neural interfaces and microrelays: record of a thesis}},
year = {2026},
url = {https://academicancestry.org/thesis/caltechthesis/caltechthesis%3A4474},
note = {read on 2026-10-23}
}apa
Academic Ancestry. (2026, October 23). Through-wafer 3-D micromachining and its applications for neural interfaces and microrelays: Record of a thesis [Read on 2026-10-23]. https://academicancestry.org/thesis/caltechthesis/caltechthesis%3A4474